Method of making plated shot



Patented Dec. 16, 1930 UNITED STATES PATENT OFFICE EDWIN PUGSLEY, OF NEWHAVEN, CONNECTICUT, ASSIGNOR, BY MESNE ASSIGN- MEN'I'S, TO WINCHESTERREPEATING ARMS WARE No Drawing.

This invention relates to methods of making shot for shot shellsand moreparticularly to a method of making plated shot.

In the manufacture of shot at the present time globules of molten lead,or an alloy of lead, are dropped into a bath ofwater. When the globulesof moltenlead'fall into the tank of water the metal is chilledformingthe shot. In some instances the shot is plated with variousmetals, such as copper, and heretofore this plating operation has beenperformed by'the usual electroplating process using electric currentsupplied to a plating bath in which the unplated shot is placed.Articles made 'of lead may also be plated with copper by dipping them ina copper sulphate solution containing a quantity of metallic iron, butsuch process has not been utilized for plating shot as it is moreexpensive than the ordinary electroplating process.

In the present invention I provide a method of making plated shotwherein the two-step process of forming the shot and I thenelectroplating it is materially simplified, and the same, or better,results obtained by means of a one-step process. Instead of using awater bath for chilling the molten lead, I drop the globules of leadinto a solution that will form the'shot, and at-the same time, provide aplating of the desired metal on the shot. Thus when a copper plating isdesired, a solution of copper sulphate containing a quantity of metalliciron may be used. I preferably employ iron in the form.

of degreased chips or other clean scrap. The globules of molten lead, orlead alloy, are dropped into. this solution whence they are 0 chilledand form shot. In contact with lead, themetallic iron replaces thecopper of the copper sulphate and the released metallic copper platesthe formed shot.

The strength of the copper sulphate solu- 5 tion may vary within widelimits. The quantity of iron added to the solution may also vary as itis merely necessary thatsome metallic iron be in contact with the shotat all 1 times to replace the copper and the iron may '50 be addedperiodically to the tank contain- COMPANY, A CORPORATION OF DELA-Miirnon or Max ne PLATED snocr \Application filed January 9, 1929.Serial No. 331,895.

ing the copper sulphate solution into which the lead globules aredropped.

An important commercial consideration in connection with my invention isthatin every ammunition manufacturing plant where lead shot is made, asolution of copper sulphate and z nc-sulphate is alwaysravailable as aWaste product from various operations in the tanks at thebase of theshot tower. The lead,

or alloy of lead, is formed into molten globules 1n the same manner asheretofore employed in the manufacture of shot and then dropped intothis solution. When the plated shot is removed from the tanks at thebase of the tower, it may in' the customary manner.

My invention is applicable to shot made either of lead or an alloy oflead and throughout the claims the Word lead is used to include the.various alloys of lead employed in the manufacture of shot.

I claim: 1 v 1. The process of making plated lead shot which comprisesdropping globules of mol ten'lead' into a solution of a metallic saltcontaining a metal adapted to replace the metal of the salt when lead isdipped in the solution whereby the globules are formed into shotandplated with-the metal of the salt.

2. The process of making plated lead shot which comprises droppingglobules of molten lead into a solution of a soluble copper saltcontaining metallic iron whereby the copper of the salt is replaced bythe iron, the globules formed into shot and the shot plated with copper.

3. The process of making plated lead shot be tumbled and inspected whichcomprises dropping globules of molten lead into a solution of coppersulphate containing metallic iron whereb iron sulphate and metalliccopper are ormed, the

5 lead globules formed into the shot and the shot plated with copper.

In testimony whereof I affix my signature.

EDWIN PUGSLEY.

